Centillium Communications, Inc.

For Centillium:

Susie Reeves

Reeves & Associates

(650) 577-0688

[email protected]

CENTILLIUM TECHNOLOGY LEVERAGES UMC GROUP MANUFACTURING FOR G.LITE DSL CHIPSET SOLUTIONS

FREMONT, Calif., April 19, 1999 – Centillium Technology Corporation, a leader in Digital Subscriber Line (DSL) chipset solutions, today announced that UMC Group, a world leading semiconductor foundry group, will manufacture G.Lite ADSL (G.992.2) chipset components for Centillium.

UMC Group will provide Centillium with production capacity support for its CopperLite Central Office (CO) and Customer Premises Equipment (CPE) G.Lite ADSL chipset solutions. UMC Group will manufacture the analog chip component of these highly integrated chipsets and system-on-chip solutions, enabling Centillium to meet projected ongoing demand for its products from telecommunications equipment and OEM modem manufacturers. UMC Group has high levels of expertise in mixed signal and communications technologies, which is expected to help Centillium provide higher levels of xDSL performance by integrating additional key DSL system functions into a single chip.

"UMC Group’s foundry capabilities are highly complementary to Centillium’s fabless manufacturing strategy," said William F. Mackenzie, Vice President of Operations, Centillium Technology. "Centillium has already benefited from UMC Group’s outstanding customer support, reliable quality engineering, and excellent deep submicron wafer manufacturing. We look forward to working closely with them to continue developing cost effective, highly integrated DSL chipset and system-on-a-chip solutions."

"As one of the world’s leading semiconductor foundries, UMC Group can offer fabless chip companies like Centillium a one-stop shop for all their manufacturing requirements," said Jim Ballingall, Vice President of Worldwide Marketing, UMC Group. "We offer our customers leading-edge process technologies, world-class manufacturing capacity, and competitive pricing. This allows them to focus on designing best-in-class products. Our customer-oriented services result in short cycle times and a high degree of manufacturing flexibility. We can also bring capacity online quickly to meet large unexpected increases in product demand."

About UMC Group

UMC Group is a world leading semiconductor foundry group consisting of United Microelectronics Corp. (UMC), United Semiconductor Corp. (USC), United Integrated Circuits Corp. (UICC), United Silicon, Inc. (USIC), UTEK Semiconductor Corp. (UTEK), and the first dedicated foundry in Japan, Nippon Foundry Inc. (NFI). The group leads the dedicated foundry industry in value-added design support with its Gold IP™ program. In 1998, UMC Group's L250 (0.25um) and L220 (0.22um) process technologies set the foundry industry benchmark for production volumes, capacity and yields in very deep sub-micron technology. In 1999, UMC Group will have production-ready 0.18um (L180) and copper-interconnect technology. The UMC Group Silicon Shuttle^SM test-chip program enables library vendors, IP vendors and foundry customers to verify their designs in silicon at low or no cost. UMC Group companies are headquartered in Taiwan, with marketing and customer support offices located in the United States, Japan, and the Netherlands. UMC Group (U.S.A.) offices are located at 788 Palomar Avenue, Sunnyvale, CA 94086, tel. (408) 733-8881, fax (408) 733-8090. The

company's website address is http://www.umcgroup.com.

About Centillium Technology

Founded in April 1997 and headquartered in Fremont, California, Centillium Technology is dedicated to expanding the Internet communications bandwidth. Centillium is the world's leading innovator in the emerging market for Digital Subscriber Line (DSL) chipset solutions. Centillium Technology is a fabless Communication IC company developing ITU-T-compliant DSL solutions for manufacturers of telecommunications equipment. Centillium's CopperLite Central Office (CO) and Customer Premises Equipment (CPE) chipset family is the industry's highest density , low power dissipation DSL solution specifically designed for mass consumer markets. Centillium’s CopperLite CO and CopperLite CPE chipsets are available to networking equipment manufacturers today. Additional information on Centillium is available at http://www.centillium.com.

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